Digital go Microwave corporation is established in 2006 by a team of experienced engineers.
Digital go Microwave offers an expertise in design for single, multi chip modules and printed circuit board at RF microwave and millimeter wave up to 110 GHz. The technical team combines over 12 years experiences in product development.
The capabilities highly offers a complete solutions in signal integrity, analysis, electromagnetic simulation, and modeling to integrate different integrated circuits and components. The team have bring this combination of capabilities to develop and design high speed and advanced millimeter wave packaging.
